Time: 2:00 p.m.
Ananthanarayanan Durga, Department of Metallurgy and Materials Engineering (MTM), KU Leuven, Heverlee, Belgium
Sn-Ag-Cu is one of the most widely used lead-free solders. However, the growth of intermetallics such as Cu3Sn and Cu6Sn5 during soldering greatly reduces the reliability of these solder joints. Furthermore, the material may be subject to strains, causing strain-induced diffusion and solid-state phase transformations. Phase-field model is a useful tool to study these phenomena, taking into consideration their thermodynamic and elastic properties.
In my research, I am developing a quantitative phase-field model considering elastic and chemical energies. This model is used to simulate intermetallic growth in the solder joints, coupled with elastic properties from first-principles calculations and thermodynamic and kinetic databases. The ultimate goal is to optimise the processing temperatures and compositions in order to manufacture solder joints with high reliability.
In this talk, I will present an overview of the new phase-field model, some preliminary first-principles calculations and simulations of solder joints. I will also discuss some of the main challenges involved.