ICAMS / Interdisciplinary Centre for Advanced Materials Simulation
more conferences »


Constrained grain boundary diffusion in thin copper films

M. J. Buehler, A. Hartmaier, H. Gao.

P. M. Anderson, T.Foecke, A. Misra, R. E. Rudd,

Nanoscale Materials and Modeling-Relations Among Processing, Microstructure and Mechanical Properties, MRS, 821, 8.2.1 - 8.2.6, (2004)

Download BibTEX

« back