ICAMS / Interdisciplinary Centre for Advanced Materials Simulation
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Constrained grain boundary diffusion in thin copper films

M. J. Buehler, A. Hartmaier, H. Gao.

P. M. Anderson, T.Foecke, A. Misra, R. E. Rudd,

Nanoscale Materials and Modeling-Relations Among Processing, Microstructure and Mechanical Properties, MRS, 821, 8.2.1 - 8.2.6, (2004)


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