ICAMS / Interdisciplinary Centre for Advanced Materials Simulation
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Transient liquid phase bonding (TLPB) on Cu/ln-48Sn/Cu bonds as alternative Pb-free interconnection technology improving service temperature

Date: 17.12.2009
Place: Universidad Nacional del Comahue, Argentina

Silvana Sommadossi, CONICET - Universidad Nacional del Comahue, Patagonia, Nequén, Argentina

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