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Integrity of micro-hotplates during high-temperature operation monitored by digital holographic microscopy

Y.W. Lai, N. Koukourakis, N.C. Gerhardt, R. Meyer, S. Hamann, M. Ehmann, K. Hackl, E. Darakis, A. Ludwig.

Journal of Microelectromechanical Systems, 19, 1175-1179, (2010)

Abstract
An investigation on the integrity of micro-hotplates using in situ digital holographic microscopy is reported. The surface topography and surface evolution of the devices during high-temperature operation (heating/cooling cycles) is measured with nanometer-scale resolution. A localized permanent out-of-plane surface deformation of 40% of the membrane thickness caused by the top measurement electrodes occurring after the first cycle is observed. The integrity-related issues caused by such a permanent deformation are discussed. © 2006 IEEE.


Keyword(s): Digital holography, microelectromechanical systems integrity, micro-hotplates, surface topography
Cite as: https://www.scopus.com/inward/record.uri?eid=2-s2.0-77957568514&doi=10.1109%2fJMEMS.2010.2067442&partnerID=40&md5=96b5cac11099ac11eca3065667adc7f5
DOI: 10.1109/JMEMS.2010.2067442
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