ICAMS / Interdisciplinary Centre for Advanced Materials Simulation


In situ investigation of nanometric cutting of 3C-SiC using scanning electron microscope

D. Tian, Z. Xu, L. Liu, Z. Zhou, J. Zhang, X. Zhao, A. Hartmaier, B. Liu, L. Song, X. Luo.

The International Journal of Advanced Manufacturing Technology, Springer Science and Business Media LLC,, 115, 2299–2312, (2021)

Experimentally revealing the nanometric deformation behavior of 3C-SiC is challenging due to its ultra-small feature size for brittle-to-ductile transition. In the present work, we elucidated the nanometric cutting mechanisms of 3C-SiC by performing in situ nanometric cutting experiments under scanning electron microscope (SEM), as well as post-characterization by electron back-scattered diffraction (EBSD) and transmission electron microscopy (TEM). In particular, a new method based on the combination of image processing technology and SEM online observation was proposed to achieve in situ measurement of cutting force with an uncertainty less than 1 mN. Furthermore, the cutting cross-section was characterized by atomic force microscope (AFM) to access the specific cutting energy. The results revealed that the specific cutting energy increase non-linearly with the decrease of cutting depth due to the size effect of cutting tool in nanometric cutting. The high-pressure phase transformation (HPPT) may play the major role in 3C-SiC ductile machining under the parameters of this experiment.

Keyword(s): Cubic silicon carbide Diamond cutting; In situ SEM observation; Surface integrity; Phase transformation
Cite as: https://link.springer.com/article/10.1007/s00170-021-07278-x#Abs1
DOI: 10.1007/s00170-021-07278-x
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