Linear growth of reaction layer during in-situ TEM annealing of thin film Al/Ni diffusion couples
A. Kostka, D. Naujoks, T. Oellers, S. Salomon, C. Somsen, E. Öztürk, A. Savan, A. Ludwig, G. Eggeler.
Journal of Alloys and Compounds, Elsevier BV,, 922, 165926, (2022)
During reactive layer growth in binary diffusion couples new phases can nucleate and grow. In the present work we perform in- and ex-situ interdiffusion studies in the system Ni-Al using X-ray diffraction (XRD) and analytical transmission electron microscopy (TEM). We investigate the reaction between 270 °C and 500 °C. We show that in the early stages of the solid-state reaction a small polycrystalline aluminide layer forms, while preferential grain growth follows in the later stage. In the reaction layer we detect the presence of Al3Ni by XRD and electron diffraction. Local chemical analysis by EDX in the TEM suggests that a second aluminide phase forms simultaneously. An in-situ TEM study at 380 °C shows layer growth of about 0.042 nm/s with a linear time dependence. We interpret this rate law on the basis of an interface-controlled reaction and discuss our results in the light of what is known about layer growth in thin film diffusion couples (presence/absence of predicted phases, linear/parabolic rate laws) and in view of results from the Ni-Al system published in the literature. Areas in need of further work are identified.
Keyword(s): thin film; interdiffusion; diffusion growth; growth kinetics; in situ transmission electron microscopy (TEM); XRD