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Through-process modeling of microstructure development during multi-pass hot deformation including partial recrystallization

F. Jiao, V. Mohles, A. Miroux, C. Bollmann

Materials Science Forum: Proceedings of the Aluminium Alloys 2014 - ICAA14, 794-796, 652-657, (2014)

DOI: 10.4028/www.scientific.net/MSF.794-796.652

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During reversible break-down hot rolling, recrystallization can take place during inter-pass annealing and even after the final pass, because the material is kept at high temperature throughout the process. A partially recrystallized microstructure is quite often obtained during inter-pass annealing and is the starting state for the subsequent rolling pass. This is in particular the case when fine particles are already present or have just precipitated in the microstructure. The particles can pin the moving grain boundaries in the hot deformed material with low energy stored during deformation. To transfer the partly recrystallized microstructure from the recrystallization model to the deformation model for simulation of the subsequent pass, a new link method has been developed for multi-pass through-process modeling. This method allows a direct data flow between the deformation model GIA-3IVM+ and the recrystallization model CORe. This new model framework was used to simulate the microstructure evolution during break-down hot rolling of precipitates containing alloy AA6016. The predicted microstructure agrees well with experimental observations.

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{"type":"inproceedings", "name":"f.jiao20146", "author":"F. Jiao and V. Mohles and A. Miroux and C. Bollmann", "title":"Throughprocess modeling of microstructure development during multipass hot deformation including partial recrystallization", "journal":"Materials Science Forum: Proceedings of the Aluminium Alloys 2014 - ICAA14", "volume":"794-796", "OPTnumber":"8", "OPTmonth":"6", "year":"2014", "OPTpages":"652-657", "OPTnote":"", "OPTkey":"AA6016; Modeling; Multi-Pass Process; Partial Recrystallization; Particle Pinning; Zener Drag", "DOI":"10.4028/www.scientific.net/MSF.794-796.652"}
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